Stacked planar double-gate lamellar field-effect transistor

ABSTRACT

A method of making a field-effect transistor device includes providing a substrate with a fin stack having: a first sacrificial material layer on the substrate, a first semiconductive material layer on the first sacrificial material layer, and a second sacrificial material layer on the first semiconductive material layer. The method includes inserting a dummy gate having a second thickness, a dummy void, and an outer end that is coplanar to the second face. The method includes inserting a first spacer having a first thickness and a first void, and having an outer end that is coplanar to the first face. The method includes etching the first sacrificial material layer in the second plane and the second sacrificial material layer in the fourth plane. The method includes removing, at least partially, the first spacer. The method also includes inserting a second spacer having the first thickness.

BACKGROUND

The present disclosure relates to field-effect transistor devices andmore particularly, to techniques for fabricating a stacked planarfield-effect transistor device.

In its basic form, a field-effect transistor (“FET”) includes a sourceregion, a drain region and a channel between the source and drainregions. A gate regulates electron flow through the channel between thesource and drain regions.

Gate all-around or double gate lamellar FETs may enable density scalingbeyond current planar complementary metal-oxide-semiconductor (“CMOS”)or fin FET (“FinFET”) technology. There are, however, notable challengesrelated to fabrication and structure of gate all-around or double gatelamellar FETs.

SUMMARY

Embodiments of the present disclosure provide for a field-effecttransistor device and method of making a field-effect transistor device.

One embodiment is directed toward a method of making a field-effecttransistor device. The method includes providing a substrate with a finstack having: a first sacrificial material layer on the substrate, afirst semiconductive material layer on the first sacrificial materiallayer, and a second sacrificial material layer on the firstsemiconductive material layer. The method includes inserting a dummygate having a second thickness, a dummy void, and an outer end that iscoplanar to the second face. The method includes inserting a firstspacer having a first thickness and a first void, and having an outerend that is coplanar to the first face. The method includes etching thefirst sacrificial material layer in the second plane and the secondsacrificial material layer in the fourth plane. The method includesremoving, at least partially, the first spacer. The method also includesinserting a second spacer having the first thickness, and a second voidonto the first face so that the second spacer exposes and surrounds thesemiconductive layer.

Another embodiment is directed toward a semiconductor device. The deviceincludes a semiconductor substrate. The device includes a field effecttransistor (FET) separated from the semiconductor substrate by aninsulator. The FET includes a first source/drain region and a secondsource/drain region having a first dopant type. The FET includes aplurality of lamellar channels parallel to the substrate having a firstend and a second end, the first end and second end are electricallycoupled to respective first source/drain region and second source/drainregion, and the plurality of lamellar channels have a length between thefirst source/drain region and second source/drain region, wherein eachlamellar channel is between 5 nm and 10 microns wide. The deviceincludes an all-around gate surrounding at least a portion of the lengthof the plurality of lamellar channels, the gate having a gate dielectricaround the lamellar channel and a gate metal around the gate dielectric,the lamellar channels surrounded by the gate having a second dopanttype. The device includes a first insulating spacer between the firstsource/drain region and the gate metal. The device also includes asecond insulating spacer between the second source/drain region and thegate metal, wherein the first insulating spacer and the secondinsulating spacer surround a portion of the length of the plurality oflamellar channels at the respective first ends and second ends, whereinthe first insulating spacer and the second insulating spacer areconfigured to limit the capacitance between the gate metal and therespective first source/drain region and second source/drain region.

Improved techniques for fabrication and improved structure for gateall-around or double gate lamellar FETs may be desirable.

The above summary is not intended to describe each illustratedembodiment or every implementation of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included in the present application are incorporated into,and form part of, the specification. They illustrate embodiments of thepresent disclosure and, along with the description, serve to explain theprinciples of the disclosure. The drawings are only illustrative ofcertain embodiments and do not limit the disclosure.

FIGS. 1A-1D illustrate isometric representations of operations in aprocess flow for a method of making a field-effect transistor (“FET”),according to various embodiments.

FIGS. 2A-2B illustrate isometric representations of operations in aprocess flow for a method of making a FET, according to variousembodiments.

FIGS. 3A-3B illustrate isometric representations of views of a FET,according to various embodiments.

FIGS. 3C-3D illustrate isometric representations of cut-away views of aFET, according to various embodiments.

FIGS. 4A-4B illustrate two-dimensional representations ofcross-sectional views of a FET, according to various embodiments.

FIG. 5 illustrates a flowchart of a method of making a FET, according tovarious embodiments.

While the embodiments are amenable to various modifications andalternative forms, specifics thereof have been shown by way of examplein the drawings and will be described in detail. It should beunderstood, however, that the intention is not to limit the disclosureto the particular embodiments described. On the contrary, the intentionis to cover all modifications, equivalents, and alternatives fallingwithin the spirit and scope of the disclosure.

DETAILED DESCRIPTION

Aspects of the present disclosure relate to techniques for fabricating(and related structures of) field-effect transistors (“FETs”). Moreparticular aspects relate to techniques for fabricating (and relatedstructures of) double gate lamellar FETs using one or more internaldielectric spacers. Double gate lamellar FETs may be fabricated througha multi-operation process flow.

Generally, FETs come in various forms, one of which is themetal-oxide-semiconductor FET (“MOSFET”). While prevalent in today'smicrochips and logic devices, MOSFETs have various shortcomings. Some ofthese shortcomings come into greater focus as the size of the die usedfor manufacturing the MOSFETs becomes smaller and smaller, measured intens of nanometers or less in some cases. For simplicity, FET may beused herein to denote various FETs, including MOSFETs, according tovarious embodiments.

Traditionally, FETs have often been configured in a horizontal, planarlayout. However, as FETs have become smaller, various issues such asparasitic capacitance and short-channel effects, among others, havebecome greater hindrances and have tended to impair the progress ofFETs' performance in the planar layout. To combat these various issues,new layouts and structures have been developed, such as the FinFET. In ageneral sense, FinFETs use rows of vertically-oriented FETs, which maybe described as “finlike,” in order to create greater physicalseparation between various FETs within a single device. However, FinFETsalso have various drawbacks, such as various issues related to parasiticcapacitance and limitations on manufacturing, spacing, or overall FETdensity, among others. The term “Tri-gate” can be substituted for theterm “FinFET” in this disclosure, according to various embodiments.

Various problems may currently exist for FinFETs as they currentlyexist. FinFET electrostatics are controlled by the width of theassociated fin (“D-fin”), which therefore must be well controlled. SinceD-fin variation must be well controlled, this dimension is typicallycreated by transferring a sidewall created from forming a spacer on amandrel so that the common drain (“CD”) is more closely determined froma deposited film thickness rather than a lithography-defined dimension.However, due to issues in pattern transfer, there are still bothsystematic and random variation in CD, such as the end-fins of an arraybeing larger than those inside the array. These larger end-fins must beremoved, which wastes area.

Another problem that currently exists in FinFETs is that the FinFETsmust be tall in order to provide current density per layout footprintsimilar to planar devices. In fact, to make up for additional parasiticsthat the fins have, it is typical to further increase the fin heightsuch that the current density is higher than planar. Creating tall,skinny fins presents many challenges, e.g., spacer formation.

Another limitation of current FinFET design relates to spacing. FinFETsmust be placed close together to support the current densityrequirements listed herein. This creates a high aspect ratio trenchbetween the fins, which complicates (in replacement gate) dummy gatepatterning and spacer formation, as well as final gate metallization.

Gate all-around nanowire face similar challenges to FinFETs in terms ofdrain wire (“D-wire”) control and achieving high current density perlayout footprint.

A possible solution to the above listed problems exists, usingimpractical fabrication techniques, such as hydrogen silsesquioxane(HSQ) and dummy/suspension gates. The resulting structure hassignificantly worse than acceptable parasitics.

While technically gate all-around, the thin and wide nature of thechannel as described herein may be more appropriately described asdouble gate. The stacking dramatically increases current density perlayout footprint. Also, the channel thickness that dictateselectrostatics is set by a deposited thickness, rather than one createdfrom pattern transfer. Also, the aspect ratio presented to processessuch as dummy-gate and spacer reactive ion etching (“RIE”) may be muchmore relaxed than for a FinFET. Compared to prior art, this disclosuredescribes a structure and making thereof with reduced parasitics, andwhile using more conventional fabrication techniques.

Utilizing a multi-layered, three-dimensional FET layout may allow formitigation of various drawbacks compared to other FET designs Likewise,efficiency, performance, or FET density may be improved. One example ofa three-dimensional FET layout is a lamellar (i.e., stacked planar)double gate FET device, which will be further described in thisdisclosure. The descriptor “lamellar” may generally denote a thin plate,scale, or layer. Lamellar may therefore be useful and appropriate todescribe the structure or structures described herein, according tovarious embodiments.

Various comparisons may be made between FinFETs and lamellar FETs asdescribed herein:

-   1. FinFETs may generally use sidewall image transfer (“SIT”)    patterning. Lamellar FETs may instead use traditional patterning    processes, including direct patterning.-   2. FinFETs may generally include a layout with integer widths,    whereas a lamellar FET may have continuous layout, where channel    widths may vary.-   3. FinFETs may have junctions that are graded over the device width.    Lamellar FETs may instead have junctions that are constant over the    device width.-   4. A FinFET may have 3D capacitance shared over a small width,    whereas a lamellar FET may have 3D capacitance shared over a    relatively large width.-   5. A FinFET's spacer profile is generally critical, whereas the    spacer profile on a lamellar FET is more relaxed, and the height of    a slab can vary.-   6. The aspect ratio of the fin of a FinFET is generally limited by    reactive-ion etching processes (“RIE”), whereas the aspect ratio for    lamellar FET is limited by release etch selectivity.-   7. The RIE profile of a FinFET is generally critical, whereas it is    more relaxed with lamellar FET.-   8. D-fin control is through SIT and RIE for FinFET, but through    epitaxy and release etch sensitivity for lamellar FET.-   9. Channel orientation for FinFET is (110)/<110>, whereas the    orientation is (100)/<110> for lamellar FET.-   10. The fin pitch for FinFET is defined by the lithography and RIE    limits. For lamellar FET, it is limited by epitaxy.-   11. The fin height/fin pitch (“fin effect”) is less than 2 for    FinFET, but can be 2, 4, 6, and up for lamellar FET.-   12. III-V materials are a question for patterning in FinFET, but    they may be acceptable for lamellar FET.

Various methods may be utilized to make a semiconductor device having alamellar stacked planar FET. For example, a fin stack, including layersof semiconductive material and layers of sacrificial material, may beadded to a provided substrate (also known as a wafer). The fin stack mayhave three pairs of sides, each pair being parallel to each other, witheach pair of sides being perpendicular to the other two pairs of sides.The first pair including a top side and a bottom side, the second pairincluding a front side and a back side and a third pair including twolateral sides. The two lateral sides constitute the last two sides ofthe fin stack, making a total of six sides, The front and back sides ofthe fin stack may correspond to the front and back sides of thesemiconductor device, respectively. A first spacer and a dummy gate,separated by a deposited oxide layer, may be placed on the fin stack.The sacrificial and semiconductive layers of the fin stack may then beplanarized on a front side at a first face, and the sacrificial layersselectively partially removed (e.g., by etching) on the same side,leaving protruding fins of semiconductive material separated bytrenches. The protruding fins of semiconductive material layers may bedenoted as lamellar channels. The first spacer and the oxide layer maythen be removed and replaced with a second spacer and oxide layer. Thesecond spacer may cover the etched sacrificial material layers of thefin stack, but the second spacer may leave the ends of the lamellarchannels exposed. On the exposed end of the lamellar channels at theback side may be formed a first source/drain region. Any gapssurrounding the source/drain region may then be filled with a gap-filldielectric, which may then be planarized. The dummy gate may then beremoved and the sacrificial material layers may be selectively partiallyremoved on the dummy gate side of the device. A high-k dielectric maythen be applied to the protruding semiconductive material layers as theremaining areas, including the partially removed sacrificial layers andthe second spacer. A replacement metal gate process may then surroundthe lamellar channels on the dummy gate side of the device, creating alamellar gate all-around FET.

High-k dielectric may be defined as a dielectric with a dielectricconstant (k) value higher than SiO₂. More specifically, a high-kdielectric may have a k higher than 3.9. Various examples of high-kinclude, but are not limited to, hafnium dioxide (HfO₂), zirconiumdioxide (ZrO₂) and titanium dioxide (TiO₂) hafnium silicate (HfSiO₄), orzirconium silicate (ZrSiO₄). As used herein, dielectric may refer tohigh-k or non-high-k dielectric materials.

While the present disclosure is not necessarily limited to suchapplications, various aspects of the disclosure may be appreciatedthrough a discussion of various examples using this context.

FIGS. 1A-1D illustrate isometric representations of operations in aprocess flow for a method of making a FET, according to variousembodiments.

FIG. 1A illustrates a front isometric representation of a firstoperation in a process flow for a method of making a FET 100, accordingto various embodiments. FIG. 1A may correspond to operations 508, 510and 514 of method 500 in FIG. 5.

A substrate 114 may be given. The substrate 114 may be made of silicon(Si), according to various embodiments. Formed on the substrate 114 maybe a fin stack 106 of alternating sacrificial layers 110 andsemiconductive layers 112. Semiconductive layers 112 may also belamellar channels. The fin stack may be formed by first creating a firstsacrificial layer 110. On the first sacrificial layer may be deposited afirst semiconductive layer 112. The first semiconductive layer 112 maybe between about 8 nanometers (“nm”) thick (top to bottom) and 250 nmwide (measured from lateral side to side) with the third dimensionmeasurement being the channel length and variable according to variousembodiments. According to one embodiment, the channel length may be lessthan about 100 nm. The first semiconductor layer 112 may be between 3 nmand 15 nm tall, according to various embodiments. A second sacrificiallayer 110 may be deposited on the first semiconductive layer 112. Theprocess of adding alternating semiconductive layers 112 and sacrificiallayers 110 may repeat until the fin stack 106 has a desired number oflayers formed on the substrate 114. The final layer added (which may bethe top layer in the fin stack 106) may be a sacrificial layer 110,according to various embodiments.

FIG. 1B illustrates a front isometric representation of a secondoperation in a process flow for a method of making a semiconductordevice 101, according to various embodiments. FIG. 1B may correspond tooperations 514 and 512 of method 500 in FIG. 5.

A dummy gate 116 may be formed and inserted. The dummy gate 116 may beformed and inserted on and around the top (i.e., last added) layer ofthe fin stack 106, and may touch the substrate 114 around the bottomends of the fin stack 106.

The dummy gate 116 material (e.g., poly-silicon) may be deposited on thefin stack 106 using low pressure chemical vapor deposition (“LPCVD”),according to various embodiments. The dummy gate 116 may then bepatterned, e.g., by etching. The patterning of the dummy gate may alignwith the outline and location of the fin stack 106.

The dummy gate 116 may have a dummy void that may not contain dummy gatematerial, and which may occupy an area of the dummy gate equivalent tothe coplanar area of the fin stack with respect to the first spacer. Thedummy void may be of the same thickness as the dummy gate from front toback and therefore the dummy gate may be completely removed along thefin stack 106. The dummy void may be located on the lower end of thedummy gate 116, and may be adjacent to the substrate 114.

The first spacer 118 material may then be deposited onto the fin stack106 and the dummy gate 116, and may have a first thickness or beplanarized to the first thickness. The deposited first spacer 118material may then be patterned into a first spacer 118. The first spacer118 may be perpendicular to the first plane and parallel to the dummygate 116, with the width of the spacer being in the lateral side to sidedirection, the direction of the lamellar channels of the individuallayers of the fin stack 106.

The first spacer 118 may have a first void, which may have a shape orsize equivalent to the coplanar area of the fin stack 106 with respectto the first spacer 118 (i.e., the parts of sacrificial layers 110 andsemiconductive layers 112 visible in 100 of FIG. 1B). The first spacer118 may have an outer end that may be coplanar to the first face. Thefirst spacer 118 may be a fin hardmask, according to variousembodiments.

The patterning of the first spacer 118 may be commensurate with anoutline and location of the semiconductive layers (which may formlamellar channels in another operation). The semiconductive layers maybe used for deposition and formation of the source/drain region, and mayform channel regions of the device, as described herein.

Prior to depositing a dummy gate 116 on the first spacer 118, an oxidelayer (not shown) may be formed on the exposed surfaces of the firstspacer 118 and fin stack 106 (oxidation step). The oxide layer may beformed on the fins using thermal oxidation. During this oxidation step,more of the sacrificial layer 110 material may be consumed than thesemiconductive layer 112 material due to different structural andchemical properties, (e.g., Ge may be more reactive than pure Si) thusresulting in laterally thinner sacrificial layers 110 thansemiconductive layers 112. The oxide layer may be formed to provide anetch stop layer for the dummy gate 116 removal process. For example, ifpoly-silicon is used as the dummy gate 116 material, an oxide layer maybe needed to protect the semiconductive layers 112 during thepoly-silicon removal operation since there may be essentially no etchcontrast between poly-silicon and various semiconductive materials,according to various embodiments. In an embodiment where a dummy gateoxide layer is deposited rather than grown, an undercut of one or moresacrificial layers may not be necessary.

The first spacer 118 may be formed from a dielectric material, such asfrom a nitride material. An example of a nitride material that may beused as a dielectric includes, but is not limited to, silicon nitride(SiN). Alternatively, the first spacer may be made of other dielectricmaterials, such as silicon dioxide (SiO₂). Insertion of the first spacer118 may begin with a spacer material (e.g., SiN, SiO₂) being depositedonto the fin stack 106 using, for example, chemical vapor deposition(“CVD”), plasma enhanced CVD (“PECVD”) or any suitable technique fordielectric deposition that does not induce a physical or chemical changeto the fin stack 106 layers.

The fin stack 106 may then be planarized at a first face, the fin stack106 being planarized so that its edge at the first face is coplanar tothe edge of the first spacer 218 along the first face. The substrate 114may not be planarized with the fin stack 106, as is further described inanother operation.

FIG. 1C illustrates a front isometric representation of a thirdoperation in a process flow for a method of making a FET 102, accordingto various embodiments. FIG. 1C may correspond to operations 518 and 520of method 500 in FIG. 5.

As described herein, the semiconductor layers 112 may form lamellarchannels (the protruding portion of the semiconductive layers 112 shown)in the device and the fin stack 106. In order to be able to form a gate(a replacement gate, not shown) that surrounds the lamellar channels,the sacrificial layers 110 may be partially removed (e.g., by selectiveetching of SiGe vs. Si, or by selective oxidation of SiGe vs. Sifollowed by a wet etch of the resulting oxide from at least the Si) fromthe fin stack 106 down to the dummy gate 116, resulting in a stack oflamellar channel layers formed from the semiconductive layers 112. Asprovided herein, a greater number of semiconductive layers 112 orsacrificial layers 110 than what are shown in the figures may beimplemented in a similar manner as described herein, except that in theinitial stages of the process, additional semiconductive layers 112 orsacrificial layers 110 may be formed in the fin stack 106. Additionallayers may be formed parallel to the first plane.

As described herein, the sacrificial layers 110 (FIG. 1B) may bepartially removed from the fin stack 106 by various means, e.g., byetching. After removal, trenches 120 may be formed. A chemical etchantmay be employed to exploit the lower oxidation potential of thesacrificial layers 110 as compared to the semiconductive layers 112.Examples of such etchants include, but are not limited to a 1:2:3mixture of HF:hydrogen peroxide (H₂O₂):acetic acid (CH₃COOH), or amixture of sulfuric acid (H₂SO₄) and H₂O₂. Alternatively, thesacrificial layers 110 may be selectively removed using a dry etchingprocess such as oxygen (O₂) plasma etching or plasma chemistriestypically used for etching.

When the sacrificial layers have been partially removed, semiconductivelayers 112 may form lamellar channels by the exposed semiconductivelayers on the front side. The lamellar channels may be used fordeposition and formation of the source/drain region, as describedherein.

According to various embodiments, a Si-selective reactive-ion etching(“RIE”) may be used to remove portions of the semiconductive 112 orsacrificial layers 110 not masked by the first spacer 118. The etchingprocess may be endpointed when the etch proceeds to the substrate 114.Accordingly, etching the substrate 114 more than necessary to etchvarious fin stack 106 layers may not be advantageous.

The orientation of the sacrificial material layer partial removal or finetch may be parallel to the various fin stack 106 layers. The firstspacer 118 may be configured to have a pitch of a set spatial frequency.To maximize layout density and minimize parasitic capacitance, the pitchmay be made as small as possible within patterning and processinglimits. To achieve pitches smaller than what can be defined by directlithography, a pitch doubling technique such as sidewall image transfer(“SIT”) or double patterning/double etching may be used. The thickness(i.e., pitch/width) of the first spacer 118 may determine the thickness(i.e., pitch/width) of the associated lamellar channels. Therefore if adesired lamellar channel thickness is known prior to the formation ofthe first spacer 118, the first spacer may be made such that the desiredlamellar channel thickness is the first thickness of the first spacer118.

The etching or partial removal of the sacrificial layers 110 from thefin stack 206 may proceed as follows. For example, a chemical etchantmay be employed that takes advantage of the lower oxidation potential ofthe sacrificial layers 110 as compared to the semiconductive layers 112.Examples of such etchants include, but are not limited to a 1:2:3mixture of HF:hydrogen peroxide (H₂O₂):acetic acid (CH₃COOH), or amixture of sulfuric acid (H₂SO₄) and H₂O₂, according to variousembodiments. Alternatively, the sacrificial layers 110 may beselectively removed using a dry etching process such as oxygen (O₂)plasma etching or plasma chemistries typically used for etching.

As the first spacer 118 is formed prior to the lamellar channelformation, once the sacrificial layers 110 are removed (e.g., byetching) from the semiconductive layers 112, a gap may be left in thefirst spacer 118 under the formed lamellar channels. If the gap were tobe left open (i.e., not filled with dielectric), then the replacementgate material could fill the gap at another operation. This additionalamount of gate material would possibly increase the harmful parasiticcapacitance of the gate to the source/drain region. The gap left in thefirst spacer 118 may be filled at another operation with a secondspacer.

Since the fin etch may be performed before the dummy gate/replacementgate operations (See FIGS. 2A-2B, 3A-3D), this process may be referredto as a fin first process.

FIG. 1D illustrates a front isometric representation of a fourthoperation in a process flow for a method of making a FET 103, accordingto various embodiments. FIG. 1D may correspond to operation 522 ofmethod 500 in FIG. 5.

A second spacer 122 may be inserted in a similar way as the first spacer118 was inserted, as described herein. The second spacer 122 may beinserted in the location vacated by the removal of the first spacer 118.The second spacer 122 may be of the same (first) thickness of the firstspacer 118. The second spacer 122 may have a second void onto the firstface so that the second spacer 122 exposes the semiconductive layers112. The second void of the second spacer 122 may have an area similarto the area of the first void of the first spacer 118, except that thetrenches formed from the recessed sacrificial layers (120, FIG. 1C) maybe covered by the second spacer, only exposing the semiconductive layers112 (i.e., the lamellar channels) on the front side.

FIGS. 2A-2B illustrate isometric representations of operations in aprocess flow for a method of making a FET device, according to variousembodiments.

FIG. 2A illustrates a back isometric representation of a fifth operationin a process flow for a method of making a FET 200, according to variousembodiments. FIG. 2A may correspond to operation 524 of method 500 inFIG. 5.

Epitaxy may be used to form a source/drain region 226 on the exposedportions of the fin stack 106, including lamellar channels formed fromthe semiconductive layers 112. The source/drain region 226 may also beformed on the second spacer 122. The source/drain region 226 may beelectrically coupled to the semiconductive layers 112 on the first faceand touching the second spacer 122. The source/drain region 226 may be araised source/drain region, according to various embodiments. To formthe source/drain region 226 an epitaxial process may be carried outusing vapor-phase epitaxy (“VPE”), molecular-beam epitaxy (“MBE”) orliquid-phase epitaxy (“LPE”) with a gaseous or liquid precursor, such assilicon tetrachloride. The source/drain region 226 may then doped inorder to distinguish the source/drain region 226 from the lamellarchannels of the semiconductive layers 112. Doping may also occur duringthe epitaxial process, according to various embodiments. Examplesource/drain dopants may include, but are not limited to, alone or invarious combinations, boron, arsenic, and phosphorous.

Further parameters and processes for using epitaxy to form thesource/drain region 226 are known to those of skill in the art andaccordingly need not be described further herein. Another source/drainregion may be formed (not shown) on the back side of the device, inorder to complete a functional FET device having both source and drainregions.

The various techniques described herein may make use of a damascene gateprocess to construct the source/drain region 226. The source/drainregion 226 may be self-aligned with the gate (not shown), according tovarious embodiments.

A gap-fill 224 material may then be deposited onto the device formed bythe second spacer 122, the source/drain region 226 and the substrate114, filling the spaces between the second spacer 122 and the end of thedevice at the first plane. Gap-fill material 224 may include anysuitable filler material, including a dielectric material, such assilicon dioxide (SiO₂). The gap-fill material 224 may be deposited usinga high-density plasma (“HDP”), according to various embodiments.Chemical-mechanical planarization (“CMP”) may then be used to planarizethe gap-fill material 224, using the second spacer 122 as an inner etchstop, and the first face as the outer plane.

Prior to forming the source/drain region 226, the semiconductive layers112 electrically coupled to the source/drain region 226 may be dopedusing, for example, in-situ doping with a suitable source/drain dopant.Example source/drain dopants may include, but are not limited to, aloneor in various combinations, boron, arsenic, and phosphorous. Carbon orfluorine may be added as impurities to control diffusion of variousdopant species, according to various embodiments.

FIG. 2B illustrates a back isometric representation of a sixth operationin a process flow for a method of making a FET 201, according to variousembodiments. FIG. 2B may correspond to operation 528 of method 500 inFIG. 5.

The dummy gate 116 may then be removed from the device. The dummy gate116 may be removed using an aqueous (wet) etch process, a chemicaletching process, such as chemical downstream or potassium hydroxide(KOH) etching, or reactive-ion etching (“RIE”), according to variousembodiments. The dummy gate 116, when removed, may expose an oxide layerat a third face. The oxide layer may then be removed, according tovarious embodiments. The third face may be parallel to and locatedbetween the first face and the second face, according to variousembodiments.

Removal of the dummy gate 116 may result in various edges of the finstack being exposed. The sacrificial layers (shown recessed) may bepartially removed by a selective etch down to a depth of the third faceat 230. After the selective etch, lamellar channels (formed from thesemiconductive layers) 112 may be exposed, including trenches formedbetween the lamellar channels. A trench distinguishes a lamellar channel226 region of the device from an eventual gate region of the device,according to various embodiments.

The sacrificial layers 110 may be etched to a depth of the secondthickness. The first sacrificial layer 110 in the second plane and thesecond sacrificial layer 110 in the fourth plane may be etched to add adepth of the second thickness as measure from the second face to thethird face, exposing the semiconductive layers 112 as gate channels 212protruding by a second thickness.

A high-k (dielectric) layer may be deposited on the third face,according to various embodiments (not shown). The high-k layer maysurround the exposed semiconductor material (lamellar channels) exceptfor the semiconductive layers' 112 outer end at the second face, whichmay be coupled to a second source/drain region (not shown).

FIGS. 3A-3B illustrate isometric representations of views of a FET,according to various embodiments.

FIG. 3A illustrates a first isometric representation of a front view ofa FET 300, according to various embodiments.

A replacement metal gate 310 may then be deposited on the high-k gatedielectric layer 312. The gate 310 may form a gate all-around(surrounding the gate channels 212, FIG. 3B). The gate 310 may includedielectric material deposited surrounding the lamellar channels (seealso 324, FIG. 3B). The dielectric material 324 employed may be a high-kdielectric material, such as hafnium oxide, that is deposited using aconformal deposition process such as atomic layer deposition (“ALD”),according to various embodiments. A planar dielectric layer 312 may alsobe placed between the second spacer 122 and the replacement gate 310.High-k dielectrics may be well suited for a gate all-around processflow, due to a possible need for a small equivalent oxide thickness forperformance and electrostatic control reasons and also a possible needfor a relatively large physical thickness to fill gaps underneath thespacers.

Referring again to FIG. 3A, the replacement gate 310 may be a metalgate, according to various embodiments. Suitable gate materials mayinclude, but are not limited to, one or more of poly-silicon, adeposited metal, (e.g., titanium nitride [TiN], tantalum nitride [TaN],or tungsten [W]), and a hybrid stack of multiple materials such as metalpoly-silicon. The gate 310 may be planar and may be located between thesecond face and the third face. The gate 310 may be planarized at thesecond plane, according to various embodiments.

The gap-fill dielectric 224 and the source/drain region 226 are alsorepresented from a different angle.

FIG. 3B illustrates a second isometric representation of a back view ofa FET 301, according to various embodiments.

A reverse (back) angle view, as compared to FIG. 3A (similar to that ofFIGS. 2A-2B) of the completed FET is shown, A replacement gate 310 maybe formed in the trenches surrounding a gate dielectric 324, which maysurround gate channels 212. The gate 310 may be formed by filling thetrenches with a gate material. Once the gate material has filled intotrenches, CMP may be used to planarize the gate material. Suitable gatematerials may include, but are not limited to, one or more ofpoly-silicon, a deposited metal, (e.g., titanium nitride [TiN], tantalumnitride [TaN], or tungsten [W]), and a hybrid stack of multiplematerials such as metal poly-silicon. Gate dielectric materials mayinclude, but are not limited to, hafnium (Hf) or zirconium (Zr).

The gate dielectric 324 may be used to surround the gate channels 212.As provided herein, the gate dielectric may be a high-k dielectricdeposited using a conformal process, such as ALD. The gap between thegate channels 212 and the gate dielectric 310 may be filled by the gatedielectric 324, and the gate material may not enter the gap. A gatedielectric (e.g., high-k) may be formed on exposed portions of the finsprior to deposition of the replacement gate material. The gatedielectric may be formed using a thermal oxidation process, according tovarious embodiments.

At various dimensions, a high-k dielectric may be employed because asmall equivalent oxide thickness (“EOT”) may be required for performanceand electrostatic control reasons. However, various physical thicknessesto fill the gap may be necessary, according to various embodiments.

The replacement gate (310, FIG. 3B) may be formed in and around thetrenches surrounding the gate channels 212. The replacement gate 310 maybe formed after the gate dielectric 324 and planar dielectric layer 312are deposited. First, the trenches may be filled with a gate material.Once the gate material is filled into trenches, CMP may be used toplanarize the gate material. Suitable gate materials may include, butare not limited to, one or more of poly-silicon, a deposited metal(e.g., titanium nitride [TiN], tantalum nitride [TaN], or tungsten [W])and a hybrid stack of multiple materials such as metal poly-silicon.

As described in detail herein, the replacement gate 310 may be formedsurrounding gate channels (with high-k dielectric in between) of thedevice, in a gate all-around configuration. Functionally, a gateall-around configuration using thin, wide lamellar FETs may befunctionally similar to a double gate configuration. Accordingly, thetwo terms may be used interchangeably throughout this disclosure.

FIGS. 3C-3D illustrate isometric representations of cut-away views of acompleted FET, with various components selectively removed forillustrative purposes, according to various embodiments.

FIG. 3C illustrates a third isometric representation of a cut-away backview of a FET 302, according to various embodiments.

Shown is a completed FET device structure after replacement gateformation, according to various embodiments. In this example, thereplacement gate 310 has been selectively removed, for illustrativepurposes. This example shows the gate channels 212 and how the gatechannels 212 are surrounded by the gate dielectric layer 324 (a gateall-around or double gate).

Accordingly, the gate dielectric 324 may be used to fill the gap betweenthe gate channels 212 and the gate material 310. The gate dielectricmaterial employed, e.g., a high-k dielectric, may be deposited using aconformal process, such as ALD.

The planar dielectric layer 312 may fill the space left by thesacrificial layers of the fin stack, as depicted at 320. The sacrificiallayers may be fully removed prior to or during the deposition of theplanar dielectric layer 312, and may therefore no longer be exposed,according to various embodiments.

Also shown are the source/drain region 226, the gap-fill 224, the secondspacer 122, the planar dielectric layer 312 and the substrate 114, asdescribed herein.

FIG. 3D illustrates a fourth isometric representation of a cut-away backview of a FET 303, according to various embodiments.

As depicted here, the gate dielectric (FIG. 3C, 324; not shown) has beenselectively removed from surrounding the gate channels 212 forillustrative purposes. The planar dielectric layer 312 can be seenexposed next to the protruding gate channels 212.

Also shown are source/drain region 226, gap-fill 224, the second spacer122, and the substrate 114, as described herein.

FIGS. 4A-4B illustrate two-dimensional cross-sectional views of acompleted FET device, according to various embodiments. FIGS. 4A-4Billustrate an embodiment of the FET device having two source/drainregions located on opposite sides of the lamellar channels. FIG. 4B mayrepresent two mirrored device representations of various other FIGS.described herein, according to various embodiments. An example of afunctional FET having a source region and a drain region is thusrepresented in this FIG.

FIG. 4A illustrates a first two-dimensional representation of across-sectional view of a completed FET device 400, viewing a sectionalong the gate, according to various embodiments.

FIG. 4B illustrates a second two-dimensional representation of across-sectional view of a completed FET device 401, viewing a sectionacross the gate (i.e., rotated 90 degrees about a vertical axis ascompared to FIG. 4A), according to various embodiments.

A substrate 418 may lie at the base of the FET device. The substrate 418may lie below a buried oxide (“BOX”) layer 416. The substrate may besilicon, according to various embodiments.

The BOX layer 416 may lie between a substrate 418 and the gap-fill 426,spacer 414, source/drain regions 430 and 431, and silicon-on-insulator(“SOI”) 420, according to various embodiments.

A fill metal 412, which may form a gate, may surround the high-kdielectric layer 428. The fill metal 412 may be located above and belowthe stack of semiconductive channels at 410.

A dielectric layer 420 (e.g., SOI) may partially surround the fill metal412, while touching 416 and above the SOI layer on the substrate 418.

A spacer 414 may be located between gap-fill 426, BOX layer 416 and SOI420 according to various embodiments. The spacer 414 may be locatedbetween gap-fill at 426 and the stack of semiconductive channels at 410.The spacer 414 may be similar to the second spacer at 122 of FIG. 2A,according to various embodiments.

Semiconductive channels 410 may be located in the FET device 400.Semiconductive channels 410 (i.e., semiconductive layers) may be locatedbetween source/drain regions 430 and 431, and dielectric 428. Thesemiconductive channels 410 may be between about 8 nanometers (nm) and250 nm wide (measured from lateral side to side), according to variousembodiments. The semiconductive channels 410 may be between 3 nm and 15nm tall, according to various embodiments.

High-k dielectric layers 428 may surround and separate (in thedimensions depicted) semiconductive channels 410 and fill metal 412.Sacrificial layers 432 may be located next to high-k dielectric layersin the view across gate of FIG. 4B, according to various embodiments.Dielectric layers may also surround fill metal 412 in the dimensionsdepicted in FIG. 4A, according to various embodiments. At 428, a high-kdielectric layer may surround the semiconductive channels, and the fillmetal 412.

A gap-fill dielectric 426 may fill a space between BOX layer 416 andsource/drain regions 430 and 431. The BOX layer may be formed to providean etch stop layer for the dummy gate removal process. When poly-siliconis used as the dummy gate material, a layer may be needed to protect thefin stack channel during the dummy gate removal operation as there maybe minimal etch contrast between the dummy gate and the semiconductivelayers, according to various embodiments. A gap-fill 426 may be locatedsurrounding the source/drain region(s), according to the dimensionsdepicted.

FIG. 5 illustrates a flowchart of a method 500 of making a FET,according to various embodiments. The method 500 may include a processflow with a plurality of operations. The operations may generallyinclude creation and insertion of a substrate and a fin stack havingsacrificial and semiconductive layers, insertion and removal of spacersand dummy gates, selective etching of sacrificial layers, deposition ofhigh-k layer, and a replacement metal gate process.

At operation 508, the method 500 may start by forming a substratematerial. A machine may cut the substrate material into a substrate,which may be provided in a first plane. The substrate may be a bulksilicon (Si) wafer or a Si layer with a silicon-on-insulator (“SOI”)configuration, according to various embodiments. In the case of a SOIwafer substrate, the SOI wafer may include a Si substrate and aSi-containing SOI layer separated from the Si substrate by a buriedoxide (“BOX”) layer. The SOI layer may contain silicon germanium (SiGe).In various embodiments, in order to produce a SiGe SOI wafer, asemiconductive layer (composed of, e.g., SiGe, Si, SiC, GaAs, etc.) maybe first epitaxially grown on the SOI layer. As described herein, thesubstrate may be provided in the first plane. The substrate may be cutor planarized to a thickness commensurate with the size of thecomponents to be added, according to various embodiments. For example,the thickness of the substrate may be on the order of hundreds ofmicrons.

At operation 510, a fin stack may be created. The fin stack may beinserted parallel to the first plane. The fin stack may includesacrificial (e.g., SiGe) and semiconductive (e.g., Si) layers. The finstack may further contain an alternating series of semiconductive andsacrificial layers, which may be formed on the substrate, according tovarious embodiments. Specifically, a first sacrificial layer may beepitaxially grown on the substrate. The first sacrificial layer may bedeposited on the substrate with a condensation method, according tovarious embodiments. The first sacrificial layer may be located abovethe substrate and the first sacrificial layer may be located in a secondplane that is above and parallel to the first plane. The sacrificiallayer may be formed from a sacrificial crystalline material which may beetched selectively to a semiconductive material at another operation.

A first semiconductive layer may be grown (e.g., by epitaxy) above thefirst sacrificial layer. The first semiconductive layer may be locatedabove the first sacrificial material layer in a third plane, which maybe parallel to the first plane. A second sacrificial material layer maybe grown (e.g., by epitaxy) above the first semiconductive layer, andmay be in a fourth plane, which may also be parallel to the first andthird planes. One or more additional sacrificial layers orsemiconductive layers may optionally be grown in an alternating fashionabove the substrate, according to various embodiments. The properties ofany additional sacrificial layers may be the same as the firstsacrificial layer, and the properties of any additional semiconductivelayers may be the same as the first semiconductive layer, according tovarious embodiments. A fourth plane may also be parallel to and abovethe third plane and may contain a second sacrificial layer.

At operation 512, a dummy gate of a second thickness may be inserted(see FIG. 1B, 116). A dummy gate oxide layer may be deposited on thedummy gate on the second face. The dummy gate may serve as a temporaryplaceholder for a replacement metal gate of a similar thickness, whichmay be inserted at another operation.

To form the dummy gate to be inserted, a dummy gate material may befirst deposited onto the fin stack, on the top and lateral sides of thefin stack, e.g., by blanket deposition, according to variousembodiments. According to various embodiments, the dummy gate materialmay be poly-silicon. The dummy gate may have a dummy gate void, whichmay occupy an area equivalent to the coplanar area of the fin stack withrespect to the first spacer and the first void. The dummy gate may serveas a fin hardmask, according to various embodiments.

The patterning of the dummy gate may commensurate with an outline andlocation of the fins (lamellar channels), and likewise the dummy void,which may be used to form the source/drain and lamellar channel regionsof the device in another operation.

The dummy gate may also have an outer end at the back side of the devicethat is coplanar to the second face of the fin stack.

Following deposition of the dummy gate material, the dummy gate materialmay be planarized at operation 514 (using, e.g., CMP) into the dummygate. The dummy gate may be patterned to surround the exposed portionsof the fins. The dummy gate may be planarized at a first face, accordingto various embodiments. Planarization may occur by, e.g.,chemical-mechanical planarization (“CMP”). The fin stack may beplanarized at a first face, wherein the first face is perpendicular tothe first plane. The fin stack may also be planarized at a second facethat is perpendicular to the first plane and parallel to the first face.The second face may align and be coplanar with a back end of thesubstrate, according to various embodiments.

At operation 516, a first spacer may be inserted. The first spacer maybe inserted adjacent to and parallel to the dummy gate. The first spacermaterial may be formed on and around the last added (i.e., topmost ifthe substrate is on the bottom) layer of the fin stack, and may touchthe substrate around the top end and lateral sides perpendicular to thefront and back ends of the fin stack. The first spacer may beperpendicular to and above the substrate, which is located in the firstplane.

The first spacer material may be deposited onto the fin stack, and mayhave a first thickness or be planarized to the first thickness. Thedeposited first spacer material may then be patterned into a firstspacer. The first spacer may have a first void, which may occupy an areaequivalent to the coplanar area of the fin stack with respect to thefirst spacer. The first spacer may have an outer end that is coplanar tothe first face and located on the front side of the device. The firstspacer may serve as a fin hardmask, according to various embodiments.

The patterning of the spacer may be commensurate with an outline andlocation of the fins (lamellar channels), which may be used to form thesource/drain and lamellar channel regions of the device in anotheroperation.

At operation 518, the sacrificial material layers may be selectivelypartially removed on the front side of the fin stack, for example byetching. The sacrificial layers may be selectively etched into fins.This process may be referred to as a fin etch. The sacrificial layersmay be etched laterally (i.e., along the direction of the plane in whichthe layer is located) during the fin etch. Correspondingly, the firstsacrificial material layer in the second plane and the secondsacrificial material in the fourth plane may be etched. The sacrificiallayers, following the fin etch, may be made to have a recessed depthcompared to the semiconductive layers in the front-back direction. Therelatively unaffected semiconductive layers, in contrast to the etched(i.e., partially removed) sacrificial layers, may form trenches betweenprotruding lamellar channels in the fin stack. The trenches may formdirectly above, below and between the formed lamellar channels. Forexample, the sacrificial layers may be removed from the fin stack,resulting in a suspended lamellar channel formed from the exposedsemiconductive layers. The lamellar channels may allow a separationbetween the sacrificial and semiconductive layers in order to allow forthe formation of a replacement gate at another operation, according tovarious embodiments.

According to various embodiments, the first sacrificial material layerin the second plane and the second sacrificial layer in the fourth planemay be etched to a depth of the second thickness as measured from thesecond face to the third face, which may expose the first semiconductivelayer.

At operation 520, the first spacer may be removed. The first spacer maybe removed by various means. For example, the first spacer may beremoved by using a chemical etching process, such as a selective aqueous(wet) etch, a high-temperature chemical vapor etch, a chemicaldownstream or potassium hydroxide (KOH) etch, or reactive-ion etching(“RIE”) process. When the first spacer is removed, the fin stack and theoxide layer on the dummy gate may be exposed where the first spacer hadbeen previously located, adjacent to the fin stack.

At operation 522, a second spacer may be inserted. The second spacer maybe inserted in the location vacated by the removal of the first spacerat operation 520. The second spacer may be of the same (first) thicknessof the first spacer. The second spacer may have a second void on thefirst face so that the second spacer exposes the semiconductive fins(i.e., exposed semiconductive layers). The second void may be of anarea, shape or outline similar to the first void of the first spacer,except that the recessed sacrificial layers may be covered by the secondspacer, only exposing the semiconductive fins (i.e., the lamellarchannels). Stated otherwise, the second spacer may contain morematerial, cover a greater area and may have multiple, smaller sub-voidsrather than one, larger void as the first spacer may have. The secondspacer, once inserted, may entirely surround the exposed semiconductorfins as a result. The second spacer may serve as a fin hardmask,according to various embodiments.

At operation 524, a source/drain region may be deposited. Thesource/drain region may be electrically coupled to the semiconductivelayers on the first face and touching the second spacer. Thesource/drain region may be deposited using a replacement metal gateprocess, according to various embodiments. The source/drain region maybe a raised source/drain region, according to various embodiments.

Epitaxy may be used to form the source/drain region on the exposedportions of the layers. The epitaxy used to form the source/drain regionmay be carried out using vapor-phase epitaxy (“VPE”), molecular-beamepitaxy (“MBE”) or liquid-phase epitaxy (“LPE”) with a gaseous or liquidprecursor, such as silicon tetrachloride. Further parameters andprocesses for using epitaxy to form raised source/drain regions areknown to those of skill in the art and accordingly may not be describedfurther herein. Another source/drain region may also be formed,according to various embodiments.

At operation 526, the dummy gate may be removed. The dummy gate may beremoved using an aqueous (wet) etch process, a chemical etching process,such as chemical downstream or potassium hydroxide (KOH) etching, orreactive-ion etching (“RIE”), according to various embodiments. Thedummy gate, when removed, may expose a third face on the oxide layer orthe second spacer. The third face may be parallel to the first face.

Removal of the dummy gate may result in the fin stack being exposed onthe second face.

At operation 528, the sacrificial layers at the second face may beetched to a depth of the second thickness, which may correspond to thedepth of the removed dummy gate. The sacrificial layers on the back sideof the device may be partially removed by a selective etch down to adepth of the third face The first sacrificial layer in the second planeand the second sacrificial layer in the fourth plane may be etched toadd a depth of the second thickness as measured from the second face tothe third face, exposing the semiconductive layers (i.e., the gatechannels).

After the selective fin etch on the back side, gate channels formed fromsemiconductive fins may be exposed, including trenches formed betweenthe gate channels. A trench may distinguish gate channel (semiconductivefin) regions of the device from sacrificial layer regions of the device,according to various embodiments.

A high-k dielectric layer may be advantageous compared to a standarddielectric, such as SiO_(2.) The high-k layer may be advantageous forvarious reasons, such as increased gate capacitance. The high-k layermay be deposited on the third face, according to various embodiments.Various examples of high-k materials include, but are not limited to,hafnium dioxide (HfO₂), zirconium dioxide (ZrO₂) and titanium dioxide(TiO₂) hafnium silicate (HfSiO₄), or zirconium silicate (ZrSiO₄). Thehigh-k layer may be deposited, e.g., by ALD. The high-k dielectric maybe beneficial because of increased gate capacitance without associatedleakage effects. The high-k layer may surround the exposedsemiconductive fins (i.e., the gate channels) except for thesemiconductive fins' outer end, which may be endpointed at the secondface, according to various embodiments.

A replacement metal gate may then be deposited on the high-k layer. Thereplacement metal gate may form a gate all-around (surrounding thelamellar channels) structure. The gate may be planar and may be locatedbetween the planes of the second face and the third face. The gate maybe planarized at the second face, according to various embodiments. Thereplacement gate may be metal or other appropriate substances, asdescribed herein, according to various embodiments.

As provided herein, more semiconductive and sacrificial layers than whatare shown in various figures may be implemented in the same manner asdescribed herein, except that in the initial stages of the process,additional semiconductive and sacrificial layers may be formed in thefin stack. In that case, a greater number gate channels would be formedin the appropriate operation.

The method as described above is used in the fabrication of integratedcircuit chips.

The resulting integrated circuit chips can be distributed by thefabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

Although illustrative embodiments of the present invention have beendescribed herein, it is to be understood that the invention is notlimited to those precise embodiments, and that various other changes andmodifications may be made by one skilled in the art without departingfrom the scope of the invention.

1. A method of making a field-effect transistor device, comprising thesteps of: providing a substrate with a fin stack having a plurality offins, including: a first sacrificial material layer on the substrate, afirst semiconductive material layer on the first sacrificial materiallayer, and a second sacrificial material layer on the firstsemiconductive material layer; inserting a dummy gate having a secondthickness, a dummy void, and an outer end that is coplanar to a secondface of the fin stack; inserting a first spacer having a first thicknessand a first void, and having an outer end that is coplanar to a firstface of the fin stack; removing, at least partially, the firstsacrificial material layer and the second sacrificial material layer byetching the first sacrificial material layer in a second plane and thesecond sacrificial material layer in a fourth plane; removing the firstspacer; and inserting a second spacer having the first thickness and asecond void onto the first face such that the second spacer exposes andsurrounds the first semiconductive material layer.
 2. The method ofclaim 1, further comprising: depositing a source/drain regionelectrically coupled to the first semiconductive material layer on thefirst face; removing the dummy gate, exposing a third face of the finstack that is parallel to the first face; and wherein the etching thefirst sacrificial material layer in the second plane and the secondsacrificial material layer in the fourth plane is etched to a depth ofthe second thickness as measured from the second face to the third face,exposing the first semiconductive material layer.
 3. The method of claim1, wherein the etching the first sacrificial material in the secondplane and the second sacrificial material layer in the fourth plane isetched to a depth of the first thickness as measured from the outer endof the first spacer.
 4. The method of claim 1, further comprising thesteps of: depositing a high-k dielectric layer on the third face,wherein the high-k dielectric layer surrounds the exposed firstsemiconductive material layer, except for the outer end of the firstexposed semiconductive material layer.
 5. The method of claim 4, furthercomprising the steps of: depositing a replacement gate on the high-kdielectric layer between the second face and the third face; andplanarizing the replacement gate at the second face.
 6. There method ofclaim 21, further comprising planarizing the fin stack at the first facethat is perpendicular to the first plane and at the second face that isperpendicular to the first plane and parallel to the first face.
 7. Themethod of claim 1, wherein the substrate is a silicon-on-insulator(“SOI”) wafer having an SOI layer separated from a silicon layer by aburied oxide layer.
 8. The method of claim 1, wherein the semiconductivematerial is silicon.
 9. The method of claim 1, wherein the sacrificialmaterial is silicon germanium.
 10. The method of claim 1, wherein thefirst and second spacers are silicon nitride.
 11. The method of claim 1,wherein depositing the first sacrificial material layer on the substrateis accomplished using a condensation method.
 12. The method of claim 1,wherein depositing the first semiconductive material layer on the firstsacrificial material layer is accomplished using an epitaxial process.13. The method of claim 1, wherein removing the dummy gate utilizes anaqueous etch process.
 14. The method of claim 21, wherein providing thefin stack includes creating the fin stack, wherein the fin stack isparallel to the first plane, and wherein the creating the fin stackcomprises the steps of: forming a third spacer on the stack that masksan outline and location of the plurality of fins; and using a fourthspacer to pattern the plurality of fins in the stack.
 15. The method ofclaim 1, wherein inserting the dummy gate comprises the steps of:depositing a dummy gate material surrounding the plurality of fins;planarizing the dummy gate material; forming a fifth spacer on the dummygate material that masks an outline and location of the dummy gates; andusing a sixth spacer to pattern the dummy gates.
 16. The method of claim1, wherein the dummy gate comprises poly-silicon.
 17. The method ofclaim 21, wherein the first sacrificial material layer on the substrateis located in the second plane.
 18. The method of claim 17, wherein thefirst semiconductive material layer on the first sacrificial materiallayer is located in a third plane, wherein the third plane is parallelto the first plane.
 19. The method of claim 18, wherein the secondsacrificial material layer on the first semiconductive material layer islocated in the fourth plane parallel to the first plane.
 20. (canceled)21. The method of claim 1, wherein a first plane is parallel to thesecond plane.